TSMC TSM
Leading-edge foundry + CoWoS packaging
official Four direct customers = 61% of a roughly $57B quarter, all in the Compute & Networking segment. That is up from 36% a year earlier. The split is disclosed; the names are not.
speculation Who are they? Nvidia declined to say. Two structural facts narrow it: (1) 'direct customer' means whoever Nvidia invoices — typically an ODM/OEM such as Foxconn, Quanta, Dell or Super Micro that integrates boards and racks, not the hyperscaler that ends up running them; (2) end demand is concentrated in Microsoft, Meta, Amazon, Google and Oracle, whose combined 2026 capex is around $725–800B. Press coverage tends to assume the big four hyperscalers; the ODM reading is at least as consistent with the wording. Both remain unverified.
Leading-edge foundry + CoWoS packaging
Custom AI ASIC co-design + switch silicon
HBM / DRAM
Custom AI ASIC co-design
800G/1.6T optical modules
HBM / DRAM
800G/1.6T optical modules
Power + precision/liquid cooling
Data-center power + cooling
HBM / DRAM
Optical modules + components (lasers)
Foundry
Foundry — mature + China leading edge
| BUYER | 1D | SUPPLIERS | WHAT | HOW MUCH / WHAT SHARE | CONF | SPECULATION / CAVEAT |
|---|---|---|---|---|---|---|
| MSFT | - | Nvidia, AMD, Marvell, Broadcom, Vertiv, GE Vernova, Caterpillar, Arista, Foxconn | GPUs; Helios racks; Maia custom accelerator; cooling; on-site gas generation | $110–120B capex (2026); two GE Vernova turbines + Caterpillar Solar Turbines on the Chevron gas project | research | Individual vendor spend is not broken out. Frequently named as a candidate for Nvidia's 'Customer A/B' — unconfirmed. |
| META | - | Nvidia, Broadcom, Schneider Electric, Quanta | GPUs; MTIA custom accelerator; power distribution; rack integration | $125–145B capex (2026), raised from $60–65B planned for 2025 | research | MTIA volumes undisclosed. Also a common guess for an unnamed Nvidia >10% customer. |
| AMZN | - | Nvidia, Marvell, Alchip, TSMC, Eaton | GPUs; Trainium accelerators (Marvell/Alchip co-design, TSMC wafers); electrical distribution | ~$200B capex (2026) | research | Trainium-3 unit volumes and the Marvell/Alchip split are not public. |
| GOOGL | - | Broadcom, MediaTek, Marvell, TSMC, Nvidia | TPU v7 (N3P dual-chiplet); new inference silicon; GPUs for GCP customers | $175–185B capex (2026); Marvell warrant lets Google buy up to $12.2B of MRVL shares | press | Marvell's exact TPU-stack scope is reported, not confirmed in detail; Broadcom remains lead partner. |
| ORCL | - | Nvidia, AMD, Crusoe, Vantage, Bloom Energy, Vertiv, Foxconn | ~$40B of Nvidia GPUs; 50,000 AMD MI450s from Q3 2026; leased campuses; on-site power | FY27 capex guided $80–100B; ~$638B RPO | official | The $40B Nvidia figure is reported rather than filed. Bloom/Vertiv site assignments are inferred from sector reporting. |
| PRIVATE | - | Nvidia, AMD, Broadcom, Oracle, Microsoft, CoreWeave | 10 GW Nvidia systems; 6 GW AMD Instinct; 10 GW Broadcom custom accelerators; Oracle-contracted capacity | >$300B/5yr Oracle contract; up to $100B Nvidia investment alongside the 10 GW LOI | official | Capacity commitments are letters of intent and multi-year frameworks, not delivered hardware. Delivery risk is real: the first AMD gigawatt only lands in H2 2026. |
| AAPL | - | TSMC | Leading-edge consumer SoC wafers | 17% of TSMC 2025 revenue (NT$645.1B ≈ US$20.5B), down from 22% in 2024 | research | Share fell because Nvidia's spend doubled, not because Apple cut orders. |
| NVDA | - | TSMC, SK hynix, Samsung, Micron, InnoLight, Eoptolink, Coherent, Amkor, Ibiden | Wafers + CoWoS; HBM4; 800G/1.6T optics; assembly/test; ABF substrate | 19% of TSMC 2025 revenue (US$23.2B); ~60% of TSMC 2026 CoWoS; ~70% of its HBM4 from SK hynix | press | The Samsung/Micron split of Nvidia's residual ~30% HBM4 is inference, not disclosure. |
| AMD | - | TSMC, Samsung, Micron, SK hynix | N2P wafers for MI450 XCD; 12-high HBM4 stacks | ~31 TB of HBM4 per Helios rack; shipments from late Q3 2026 | press | 'Majority from Samsung + Micron' is reported; no party has published an allocation table. |
| AVGO | - | TSMC | Wafers for every co-designed accelerator it ships | ~60% of AI compute ASIC design partnerships | research | Share is a research-firm estimate of design wins, not of revenue. |
| CRWV | - | Nvidia, Dell, Vertiv | GPU fleet; servers; cooling | Not disclosed | press | Sits inside the Nvidia–OpenAI–Oracle circular-financing web; exposure is hard to size from outside. |
| 2317.TW | - | Nvidia, Delta Electronics | GPUs and boards for GB300 NVL72 rack integration; rack power electronics | Not disclosed | press | As a named Blackwell manufacturing partner it is a plausible unnamed Nvidia >10% direct customer. Never confirmed. |
| 3231.TW | - | Nvidia | GPU board and rack integration | Not disclosed | press | Same 'Customer A–D' caveat as Foxconn. |
| 2382.TW | - | Nvidia | Rack integration | Not disclosed | background | Named in coverage of the 10-Q disclosure as part of the ODM class; no figures. |
| ANET | - | Broadcom | Tomahawk-class merchant switch silicon | Not disclosed | background | Merchant-silicon shares per switch vendor are not published. |
| TSM | - | ASML | EUV lithography scanners | 100% sole-sourced | background | Structural fact rather than a 2026 figure — the single hardest point of failure in the chain. |
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How to read this. Two layers sit on this page. The supply-chain graph is curated and dated 2026-09-12: no market API publishes supply allocations, so each edge is tagged official (filing or company statement), research (market-research estimate — firms disagree, most visibly on HBM share), press (credible reporting neither side confirms), speculation (explicitly unverified — the identities behind Nvidia's Customers A–D, and the Samsung/Micron split of its residual HBM4) or background (structural, no 2026 document pulled here). Prices, percentage moves and headlines are live from Yahoo Finance on every page load. Gigawatt figures are contracts and letters of intent, not delivered capacity.